JPS587352U - 集積回路の冷却装置 - Google Patents

集積回路の冷却装置

Info

Publication number
JPS587352U
JPS587352U JP1981100151U JP10015181U JPS587352U JP S587352 U JPS587352 U JP S587352U JP 1981100151 U JP1981100151 U JP 1981100151U JP 10015181 U JP10015181 U JP 10015181U JP S587352 U JPS587352 U JP S587352U
Authority
JP
Japan
Prior art keywords
integrated circuit
heat pipe
cooling device
close contact
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981100151U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6127189Y2 (en]
Inventor
逸生 首藤
近藤 良太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1981100151U priority Critical patent/JPS587352U/ja
Publication of JPS587352U publication Critical patent/JPS587352U/ja
Application granted granted Critical
Publication of JPS6127189Y2 publication Critical patent/JPS6127189Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
JP1981100151U 1981-07-07 1981-07-07 集積回路の冷却装置 Granted JPS587352U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981100151U JPS587352U (ja) 1981-07-07 1981-07-07 集積回路の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981100151U JPS587352U (ja) 1981-07-07 1981-07-07 集積回路の冷却装置

Publications (2)

Publication Number Publication Date
JPS587352U true JPS587352U (ja) 1983-01-18
JPS6127189Y2 JPS6127189Y2 (en]) 1986-08-13

Family

ID=29894856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981100151U Granted JPS587352U (ja) 1981-07-07 1981-07-07 集積回路の冷却装置

Country Status (1)

Country Link
JP (1) JPS587352U (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015099894A (ja) * 2013-11-20 2015-05-28 富士通株式会社 電子部品のリワーク方法
JPWO2014148026A1 (ja) * 2013-03-21 2017-02-16 日本電気株式会社 ヒートシンク構造、半導体装置及びヒートシンク搭載方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014148026A1 (ja) * 2013-03-21 2017-02-16 日本電気株式会社 ヒートシンク構造、半導体装置及びヒートシンク搭載方法
JP2015099894A (ja) * 2013-11-20 2015-05-28 富士通株式会社 電子部品のリワーク方法

Also Published As

Publication number Publication date
JPS6127189Y2 (en]) 1986-08-13

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